With the advent of smart phones, people's demand for mobile phones is getting higher and higher. With the improvement of mobile phone hardware, the problem of heating is becoming more and more serious. The good thermal conductivity of FEHONDA thermal pad helps to quickly export the heat of the chip to the heat sink. Thereby achieving rapid heat dissipation. FEHONDA thermal conductive gel can achieve good contact with electronic components and greatly reduce interface thermal resistance. Quickly and efficiently cool down electronic components. FEHONDA provides effective solutions for efficient and stable operation of products
Mobile Application Solutions
The good thermal conductivity of FEHONDA thermal pad helps to quickly export the heat of the chip to the heat sink. Thereby achieving rapid heat dissipation.
FEHONDA thermal conductive gel can achieve good contact with electronic components and greatly reduce interface thermal resistance.
