Self-adhesive on both sides, not easy to peel off, soft, good compressibility, high reliability in long-term use, can be used for heat transfer between semiconductors, power devices and housings or other heat sinks;
| Parameters | Unit | Regular | Low permeation Oil | Test Standard |
|---|---|---|---|---|
| Thermal Conductivity | W/m·k | 8.0 | 8.0 | ASTM D5470 |
| Hardness | Shore C | 30~40 | 30~40 | ASTM D2240 |
| Density | g/cc | 3.3±0.2 | 3.3±0.2 | ASTM D792 |
| Thickness | mm | 0.5~3.0 | 0.5~3.0 | ASTM D374 |
| Breakdown voltage | Kv/mm | ＞9 | ＞ 9 | ASTM D149 |
| Volume Resistivity | Ω.cm | ≥1010 | ≥1010 | ASTM D257 |
| Silicone Permeability | % | ≤3 | ≤1 | 125°C/72h（compression50%） |
| Temperature Range | ℃ | -40~180 | -40~180 | / |
| Flame Rating | / | V-0 | V-0 | UL 94 |
FEHONDA's new materials are used in a variety of applications around the world, providing effective solutions for thermal conductivity, shielding and more for products. Our sales and engineering support teams are ready to help you with any questions you may have, including quotations, product application support and product customization. Please submit your request via our custom service form to ensure a faster response.
