3.8w Thermal Gel
Features and Benefits
- Low thermal impedance
- Two-part formulation for easy storage
- Room temperature cure or Heat cure
- Ultra-conforming, designed for fragile and low-stress applications
- Thixotropic nature makes it easy to dispense
- Excellent low and high temperature mechanical and chemical stability
Typical Applications
- Telecommunications / Computer and peripherals
- Fiber optic telecommunications equipment
- Between any heat-generating semiconductor and a heat sink
- Automative systems / Consumer electronics / Artificial intelligence / Fiber Module
| PROPERTIES | Unit | Value | Test Standard | 
|---|---|---|---|
| Color | / | A(White)/B(Red) | Visual | 
| Mix Ratio | / | 1:1 | / | 
| Pot life@25℃ | hrs | 3 | / | 
| Cure @25℃ | hrs | 12 | / | 
| Cure@100℃ | min | 10 | / | 
| Hardness | Shore C | 35±10 | ASTM D2240 | 
| Density | g/cc | 3.1±0.3 | ASTM D792 | 
| Dielectric Breakdown Voltage | kV/mm | ≥6 | ASTM D149 | 
| Volume Resistivity | Ω.cm | ≥1012 | ASTM D257 | 
| Thermal Conductivity | W/mk | 3.8 | ASTM D5470 | 
| Thermal Impendence@40psi&2mm | ℃.in /w | ≤0.06 | ASTM D5470 | 
| Flame Rating | / | V-0 | UL 94 | 
| Temperature Range | ℃ | -40~160 | / | 
 
                     
                     
                     
                     
                     
                     
                     
                    









 
                             
                             
                             
                            