3.8w Thermal Gel

Features and Benefifits
  • Low thermal impedance
  • Two-part formulation for easy storage
  • Room temperature cure or Heat cure
  • Ultra-conforming, designed for fragile and low-stressapplications
  • Thixotropic nature makes it easy to dispense
  • Excellent low and high temperature mechanical and chemical stability
Typical Applications
  • Telecommunications / Computer and peripherals
  • Fiber optic telecommunications equipment
  • Between any heat-generating semiconductor and a heat sink
  • Automative systems / Consumer lectronics / Artifificial intelligence / Fiber Module
Contact us for customization
3.8w Thermal Gel 3.8w Thermal Gel 3.8w Thermal Gel 3.8w Thermal Gel
3.8w Thermal Gel
PROPERTIES Unit Value Test Standard
Color
 /
A(White)/B(Red)
Visual
Mix Ratio
 /
1:1
 /
Pot life@25℃
hrs
3
 /
Cure @25℃
 hrs
12
 /
Cure@100℃
min
 10 /
Hardness
Shore C
35±10
ASTM D2240
Density
g/cc
3.1±0.3
ASTM D792
Dielectric Breakdown Voltage
kV/mm
≥6
ASTM D149
Volume Resistivity
Ω.cm
≥1012
ASTM D257
Thermal Conductivity
W/mk
3.8
ASTM D5470
Thermal Impendence@40psi&2mm
℃.in /w
≤0.06
ASTM D5470
Flame Rating
 /
V-0
UL 94
Temperature Range
℃
-40~160
 /

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