1.5W Thermal Pad
Self-adhesive on both sides, not easy to peel off, soft, good compressibility, high reliability in long-term use, can be used for heat transfer between semiconductors, power devices and housings or other heat sinks.
- Thermal Conductivity: 1.5 W/m.k
- Hardness:Shore C 20~45
- Thickness:0.5~6.0mm
- Breakdown Voltage:>6~10 Kv/mm
| Parameters | Unit | Regular | Low permeation Oil | Test Standard | 
|---|---|---|---|---|
| Thermal Conductivity | W/m·k | 1.5 | 1.5 | ASTM D5470 | 
| Hardness | Shore C | 20~45 | 20~45 | ASTM D2240 | 
| Density | g/cc | 2.0±0.2 | 2.0±0.2 | ASTM D792 | 
| Thickness | mm | 0.5~6.0 | 0.5~6.0 | ASTM D374 | 
| Breakdown Voltage | Kv/mm | > 6 | > 6 | ASTM D149 | 
| Volume Resistivity | Ω.cm | ≥10¹³ | ≥10¹³ | ASTM D257 | 
| Silicone Permeability | % | ≤3 | ≤1 | 125°C/72h(compression50%) | 
| Temperature Range | ℃ | -40~180 | -40~180 | / | 
| Flame Rating | / | V-0 | V-0 | UL 94 | 
 
                     
                     
                     
                     
                     
                     
                     
                     
                     
                     
                     
                    








 
                             
                             
                             
                             
                             
                            