FDI-1030 Thermal Conductive Insulators

Features and Benefifits

  • Electrically isolating
  • Low mounting pressures
  • Low thermal impedance
  • General-purpose thermal interface material solution
  • Smooth and highly compliant surface
  • Enhanced puncture ,shear and tear resistance

Typical Applications

  • Consumer electronics / Telecommunications / Medical devices / Industrial controls
  • Between CPU or other heatgenerating component and a heat sink
  • Isolate electrical components and power sources from heat sink and /or mounting bracket
  • Telecommunications Computer and peripherals Power conversion Consumer electronics
Contact us for customization
FDI-1030 Thermal Conductive Insulators FDI-1030 Thermal Conductive Insulators FDI-1030 Thermal Conductive Insulators FDI-1030 Thermal Conductive Insulators FDI-1030 Thermal Conductive Insulators
FDI-1030 Thermal Conductive Insulators
    Parameters                      Unit                          Value                          Test Standard                
Color /
Grey
 Visual
Thickness mm
0.3
 ASTM D374
Hardness Shore A
85
 ASTM D2240
Thermal Conductivity W/m.k 1.0 ASTM D5470
Flame Rating / V-0 UL 94
Tensile Strength Mpa
20
 ASTM D412
Dielectric Breakdown Voltage KV/mm ≥6 ASTM D149
Volume Resistivity Ω.cm ≥ 1012 ASTM D257
Temperature Range ℃ –40~180 /
Substrate / Glassfifiber /

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6.0W Thermal Pad

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7.0W Thermal Pad

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8.0W Thermal Pad

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12.8W Thermal Pad

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15.0W Thermal Pad

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