PCM8550 Thermal Phase Change Pad

Product Name​：PCM-8550
Material Type​：Phase Change Material (Pad & Paste)
Thermal Conductivity​：8.5 W/m·K
Thermal Impedance​：≤ 0.03 °C·cm²/W (@ no shim)
Phase Change Temp.​：52 °C
Thickness​：0.25 mm (Custom thicker options under development)
Density​：2.60 – 2.80 g/cm³ (±0.03)
Dielectric Strength​：≥ 10 kV
Operating Temp.​：-55 °C to +180 °C
Key Reliability​：Passes 150°C Bake (1000h) & T/C-B (1000 cycles)

PCM-8550: Ultra-High Performance Thermal Interface Material

  PCM-8550 is a next-generation Phase Change Material (PCM) available in both pad and paste formats. Leveraging a novel polymer system, it delivers an industry-leading thermal conductivity of 8.25 W/m·K​ and ultra-low thermal impedance (<0.03 °C·cm²/W).

  At its phase change point of 52°C, PCM-8550 transforms to achieve exceptional interface wetting, drastically reducing contact resistance. Engineered for reliability, it withstands extreme conditions (150°C/1000h bake, 1000 T/C-B cycles), making it the ideal solution for high-performance ICs, GPUs, and power electronics where consistent thermal management is critical.