10.0W Thermal Pad

Fehonda 10.0W/m·K High-Performance Thermal Pad

The Fehonda 10.0W/m·K Thermal Pad leverages advanced thermal interface material technology to meet the rigorous demands of high-load electronics, high-power LED lighting, and energy-dense battery systems.

With a thermal conductivity of 10.0 W/m·K, it delivers efficient and reliable heat dissipation from critical components, effectively minimizing thermal buildup, maintaining system stability, and protecting against performance loss or heat-related damage—even under sustained high-temperature operation.

Key Benefits:

  • High thermal conductivity for demanding applications

  • Excellent conformability to uneven surfaces

  • Low thermal resistance with electrical insulation

  • Stable performance in harsh thermal environments

Inquiry

Fehonda 10.0W/m·K High-Performance Thermal Conductive Pad

1. Product Introduction

The Fehonda 10.0W/m·K Thermal Pad​ is a high-performance silicone-based gap filler pad engineered with advanced thermally conductive fillers. It is specifically designed to bridge air gaps between heat-generating components and heatsinks, providing excellent thermal transfer, electrical insulation, and mechanical compliance—even under continuous high-temperature and high-vibration conditions.

With a thermal conductivity of 10.0 W/m·K, the pad effectively reduces hot spots, improves system reliability, and extends the service life of critical electronic assemblies.

2. Recommended Applications (Scope of Use)

Ideal for medium-to-high power density electronics​ requiring gap filling and insulation:

  • New Energy & Energy Storage

    • EV battery modules (cell-to-cold plate)

    • BMS (Battery Management Systems)

    • On-board Charger (OBC) & DC-DC Converters

  • Automotive Electronics

    • High-power LED headlights & matrix lamps

    • ADAS control units

  • Power & Industrial Electronics

    • IGBT / SiC power modules

    • Motor drives & inverters

  • Telecommunication & Computing

    • 5G base stations (RRU / AAU)

    • Server power supplies, GPU / FPGA cooling

 Not recommended for ultra-thin, zero-gap interfaces (use thermal grease or phase change material).
 

             Parameters                           Unit                                    Regular                      Low permeation Oil                  Test Standard                
Thermal Conductivity W/m·k 10.0 10.0 ASTM D5470
Hardness Shore C 35~45 35~45 ASTM D2240
Density g/cc 3.5±0.2 3.5±0.2 ASTM D792
Thickness mm 0.5~6.0 0.5 - 6.0 ASTM D374
Breakdown Voltage Kv/mm > 6 > 6 ASTM D149
Volume Resistivity Ω.cm ≥1010 ≥1010 ASTM D257
Silicone Permeability % ≤3 ≤1 125°C/72h(compression50%)
Temperature Range -40~180 -40~180 /
Flame Rating / V-0 V-0 UL 94

4. R&D Strength & Customization Service

Fehonda is backed by a professional in-house R&D team​ specializing in thermal interface materials (TIMs).

We support full customization​ to meet your unique application requirements:

 Custom thermal conductivity​ (1.0 ~ 15.0 W/m·K)

 Custom thickness, sheet size & die-cut shapes

 Adjustable hardness & tack (single/double side)

 Special formulations: ultra-soft, fiberglass-reinforced, high-voltage insulation

 Compatibility testing & sample support

From prototype evaluation to mass production — we tailor thermal solutions that fit your design.


 

Tell Us About Your Application Requirements

FEHONDA team will be pleased to help you select the right new material to optimize your application. Please fill in the necessary information in the form below and one of our representatives will get back to you as soon as possible.
Customer Service

FEHONDA's new materials are used in a variety of applications around the world, providing effective solutions for thermal conductivity, shielding and more for products. Our sales and engineering support teams are ready to help you with any questions you may have, including quotations, product application support and product customization. Please submit your request via our custom service form to ensure a faster response.

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