10.0W Thermal Pad
Fehonda 10.0W/m·K High-Performance Thermal Pad
The Fehonda 10.0W/m·K Thermal Pad leverages advanced thermal interface material technology to meet the rigorous demands of high-load electronics, high-power LED lighting, and energy-dense battery systems.
With a thermal conductivity of 10.0 W/m·K, it delivers efficient and reliable heat dissipation from critical components, effectively minimizing thermal buildup, maintaining system stability, and protecting against performance loss or heat-related damage—even under sustained high-temperature operation.
Key Benefits:
-
High thermal conductivity for demanding applications
-
Excellent conformability to uneven surfaces
-
Low thermal resistance with electrical insulation
-
Stable performance in harsh thermal environments
Fehonda 10.0W/m·K High-Performance Thermal Conductive Pad
1. Product Introduction
The Fehonda 10.0W/m·K Thermal Pad is a high-performance silicone-based gap filler pad engineered with advanced thermally conductive fillers. It is specifically designed to bridge air gaps between heat-generating components and heatsinks, providing excellent thermal transfer, electrical insulation, and mechanical compliance—even under continuous high-temperature and high-vibration conditions.
With a thermal conductivity of 10.0 W/m·K, the pad effectively reduces hot spots, improves system reliability, and extends the service life of critical electronic assemblies.
2. Recommended Applications (Scope of Use)
Ideal for medium-to-high power density electronics requiring gap filling and insulation:
-
New Energy & Energy Storage
-
EV battery modules (cell-to-cold plate)
-
BMS (Battery Management Systems)
-
On-board Charger (OBC) & DC-DC Converters
-
-
Automotive Electronics
-
High-power LED headlights & matrix lamps
-
ADAS control units
-
-
Power & Industrial Electronics
-
IGBT / SiC power modules
-
Motor drives & inverters
-
-
Telecommunication & Computing
-
5G base stations (RRU / AAU)
-
Server power supplies, GPU / FPGA cooling
-
Not recommended for ultra-thin, zero-gap interfaces (use thermal grease or phase change material).
| Parameters | Unit | Regular | Low permeation Oil | Test Standard |
|---|---|---|---|---|
| Thermal Conductivity | W/m·k | 10.0 | 10.0 | ASTM D5470 |
| Hardness | Shore C | 35~45 | 35~45 | ASTM D2240 |
| Density | g/cc | 3.5±0.2 | 3.5±0.2 | ASTM D792 |
| Thickness | mm | 0.5~6.0 | 0.5 - 6.0 | ASTM D374 |
| Breakdown Voltage | Kv/mm | > 6 | > 6 | ASTM D149 |
| Volume Resistivity | Ω.cm | ≥1010 | ≥1010 | ASTM D257 |
| Silicone Permeability | % | ≤3 | ≤1 | 125°C/72h(compression50%) |
| Temperature Range | ℃ | -40~180 | -40~180 | / |
| Flame Rating | / | V-0 | V-0 | UL 94 |
4. R&D Strength & Customization Service
Fehonda is backed by a professional in-house R&D team specializing in thermal interface materials (TIMs).
We support full customization to meet your unique application requirements:
Custom thermal conductivity (1.0 ~ 15.0 W/m·K)
Custom thickness, sheet size & die-cut shapes
Adjustable hardness & tack (single/double side)
Special formulations: ultra-soft, fiberglass-reinforced, high-voltage insulation
Compatibility testing & sample support
From prototype evaluation to mass production — we tailor thermal solutions that fit your design.






