12.0W Thermal Pad

 16.0W/m·K（Recommended Applications）
 

Focus: Extreme Heat Flux & High-Reliability Systems

• Power Electronics (Core Target)​

  • IGBT / SiC Power Modules (Traction Inverters, EV Drivetrains)

  • High-Frequency Rectifiers & Converters

• Energy Storage & EV​

  • Utility-scale ESS PCS (Power Conversion Systems)

  • 800V High-Voltage EV Platforms

• Advanced Computing & AI​

  • AI Server CPUs / GPUs

  • High-Performance FPGA & ASIC Cooling

• High-End Industrial & Defense​

  • Radar & High-Power RF Systems

  • Aerospace-grade Thermal Management
    ​

    • Parameters	Unit	Regular	Low permeation Oil	Test Standard
      Thermal Conductivity	W/m·k	16.0	16.0	ASTM D5470
      Hardness	Shore C	40~45	40~45	ASTM D2240
      Density	g/cc	3.9±0.2	3.9±0.2	ASTM D792
      Thickness	mm	0.5~3. 0/custom	0.5~3. 0/custom	ASTM D374
      Breakdown Voltage	Kv/mm	＞ 6	＞ 6	ASTM D149
      Volume Resistivity	Ω.cm	≥1010	≥1010	ASTM D257
      Silicone Permeability	%	≤3	≤1	125°C/72h（compression50%）
      Temperature Range	℃	-40~180	-40~180	/
      Flame Rating	/	V-0	V-0	UL 94

      Product Introduction, Applications, Technical Data & Customization

      1. Product Introduction

      The Fehonda 16.0W/m·K Thermal Pad​ is an ultra-high-performance gap filler engineered with a next-generation composite thermal system. Designed specifically for extreme heat flux and stringent junction-temperature control, this pad delivers industry-leading thermal conductivity and ultra-low interfacial thermal resistance. It effectively bridges microscopic gaps between high-power components and heat sinks, rapidly dissipating concentrated heat to prevent thermal throttling, performance degradation, or catastrophic failure in mission-critical systems.

      2. Recommended Applications

      Positioned as a premium thermal solution, the 16.0W/m·K grade targets applications where the 10.0W/m·K grade is insufficient to manage thermal loads.

    • Power Electronics (Core Focus)

      • IGBT / SiC Power Modules (Traction Inverters, On-board Chargers)

      • High-Frequency Rectifiers & High-Power DC Converters

    • Energy Storage & EV Systems

      • Utility-Scale ESS Power Conversion Systems (PCS)

      • 800V High-Voltage EV Drivetrain Cooling

    • High-Performance Computing (HPC) & AI

      • AI Server CPUs / GPUs

      • High-Performance FPGA & ASIC Modules

    • Advanced Industrial & Defense

      • High-Power RF and Radar Systems
         

        3. R&D Strength & Customization Service

        Fehonda is backed by a strong in-house R&D team​ specializing in advanced Thermal Interface Materials (TIMs). Equipped with comprehensive thermal and reliability testing laboratories, we provide tailored solutions beyond standard specifications.

        Customization Capabilities:

      • Performance Tuning:​ Thermal conductivity range from 1.0 to 16.0+ W/m·K.

      • Dimensional Flexibility:​ Supplied in rolls, sheets, or precision die-cut shapes.

      • Material Properties:​ Adjustable hardness, single/double-sided tack, and fiberglass reinforcement.

      • Special Formulations:​ Ultra-low thermal resistance grades, high-voltage insulation grades, and enhanced tear resistance.

      • Technical Support:​ Sample evaluation, thermal analysis consultation, and mass production ramp-up support.